PCBA Projects Introduction
ABIS CIRCUITS Company deliver services, not only products. We offer solutions, not only goods.
From the PCB production, the components purchasing to the components assemble. Includes:
Our Advantages
We provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI project, small and medium volume. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in supply chain and EMS industry, with deep knowledges in SMT assembly allowing to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive and consumer electronics.
PCBA Capabilities
1 | SMT assembly including BGA assembly |
2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
3 | Component height: 0.2-25mm |
4 | Min packing: 0204 |
5 | Min distance among BGA : 0.25-2.0mm |
6 | Min BGA size: 0.1-0.63mm |
7 | Min QFP space: 0.35mm |
8 | Min assembly size: (X*Y): 50*30mm |
9 | Max assembly size: (X*Y): 350*550mm |
10 | Pick-placement precision: ±0.01mm |
11 | Placement capability: 0805, 0603, 0402 |
12 | High pin count press fit available |
13 | SMT capacity per day: 80,000 points |
–Capability – SMT
Lines | 9(5 Yamaha,4KME) |
Capacity | 52 million placements per month |
Max Board Size | 457*356mm.(18”X14”) |
Min Component size | 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
Speed | 0.15 sec/chip,0.7 sec/QFP |
-Capability – PTH
Lines | 2 |
Max board width | 400 mm |
Type | Dual wave |
Pbs status | Lead-free line support |
Max temp | 399 degree C |
Spray flux | add-on |
Pre-heat | 3 |
Production Processes
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Quality Control
AOI Testing | Checks for solder pasteChecks for components down to 0201
Checks for missing components, offset, incorrect parts, polarity |
X-Ray Inspection | X-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boards |
In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
Power-up Test |
Advanced Function Test
Flash Device Programming
Functional testing
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Application