Infrared thermometer motherboard control board Custom-Make PCBA
PCBA Projects Introduction
ABIS CIRCUITS Company deliver services, not only products. We offer solutions, not only goods.
From the PCB production, the components purchasing to the components assemble. Includes:
- PCB Custom
- PCB drawing / design according to your schematic diagram
- PCB manufacturing
- Component sourcing
- PCB Assemble
- PCBA 100% test
Our Advantages
- High-end euipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hour
- High efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB production, also large-scale productions
- Professional engineering team-40 engineers and their own tooling house, strong at OEM. Offers two easy options: Custom and Standard-In-depth knowledge of IPC Class II and III Standards
We provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI project, small and medium volume. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in supply chain and EMS industry, with deep knowledges in SMT assembly allowing to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive and consumer electronics.
PCBA Capabilities
| 1 | SMT assembly including BGA assembly |
| 2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
| 3 | Component height: 0.2-25mm |
| 4 | Min packing: 0204 |
| 5 | Min distance among BGA : 0.25-2.0mm |
| 6 | Min BGA size: 0.1-0.63mm |
| 7 | Min QFP space: 0.35mm |
| 8 | Min assembly size: (X*Y): 50*30mm |
| 9 | Max assembly size: (X*Y): 350*550mm |
| 10 | Pick-placement precision: ±0.01mm |
| 11 | Placement capability: 0805, 0603, 0402 |
| 12 | High pin count press fit available |
| 13 | SMT capacity per day: 80,000 points |
–Capability – SMT
| Lines | 9(5 Yamaha,4KME) |
| Capacity | 52 million placements per month |
| Max Board Size | 457*356mm.(18”X14”) |
| Min Component size | 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
| Speed | 0.15 sec/chip,0.7 sec/QFP |
-Capability – PTH
| Lines | 2 |
| Max board width | 400 mm |
| Type | Dual wave |
| Pbs status | Lead-free line support |
| Max temp | 399 degree C |
| Spray flux | add-on |
| Pre-heat | 3 |
Production Processes
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Quality Control
| AOI Testing | Checks for solder paste
Checks for components down to 0201 Checks for missing components, offset, incorrect parts, polarity |
| X-Ray Inspection | X-Ray provides high-resolution inspection of:
BGAs/Micro BGAs/Chip scale packages /Bare boards |
| In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
| Power-up Test |
Advanced Function Test
Flash Device Programming
Functional testing
|
- IOC incoming inspection
- SPI solder paste inspection
- Online AOI inspection
- SMT first article inspection
- External assessment
- X-RAY-welding inspection
- BGA device rework
- QA inspection
- Anti-static warehousing and shipment
Application
- Communication Units
- Industrial Control
- Medical Devices
- Automotive Units
- Network Devices
- Gateway Control
