TE custormized series – Cooler
Aurin can manufacture peltier coolers with unique design features like center holes and unusual shapes. These special design thermoelectric modules are often used in laser and diode cooling. While unique shapes typically require custom design, we also offer some existing designs that may fit some common applications. Standard substrates are lapped with +/-0.025mm tolerance. Please feel free to contact us for your desired size.
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*Our advantages
Relying on professional technical team and laboratory in Shenzhen, we provide the best solutions of thermoelectric module use. Each piece of our module is tested 3 times under advanced equipments. The reject ratio of our modules is under less than five in then thousand. Our products widely applied in medical equipment, optical communication, aerospace, automotive etc. We also have professional technical team which is focusing on expanding new application of thermoelectric modules. So your requirements can be satisfied properly.
*Specification selection
According to the above, the original user should first put forward requirements to select semiconductor cooling sheets according to needs. General requirements:
① Given ambient temperature th ℃
② Low temperature Tc ℃ reached by cooled space or object
③ Known thermal load Q (thermal power QP, heat leakage QT) w
Given th, TC and Q, the required stack and the number of stacks can be estimated according to the characteristic curve of semiconductor refrigeration sheet.
1. Determine the model and specification of the cooling plate
2. After selecting the model, consult the thermoelectric refrigeration characteristic curve of the model.
3. The hot end temperature th of the semiconductor cooling fin is determined by using the ambient temperature and heat dissipation mode, and a similar TC is obtained.
4. Find out the cooling capacity of cold end QC in the corresponding characteristic curve.
5. The required number of semiconductor cooling sheets n = q / QC is obtained by dividing the required cooling capacity Q by the cooling capacity QC of each semiconductor cooling sheet
