Thermal Paste
★ Typical Properties of -8X20 Series Thermal Paste
|
Thermal Conductive Paste |
|||
|
Property |
Unit |
Product Series |
Test Method |
|
-8350 |
|||
|
Color |
|
Gray |
Visual |
|
Density |
g/cc |
3.1 |
ASTM D792 |
|
Extrusion Speed @30cc, 90psi |
g/min |
10-90 |
|
|
Application Temperature |
℃ |
-50~+200 |
|
|
Flammability Class |
|
V0 |
UL94 |
|
Thermal Conductivity |
W/m-K |
3.5 |
ASTM D5470 |
|
Breakdown Voltage |
KV/mm |
>5 |
ASTM D149 |
|
Volume Resistivity |
ohm-cm |
10^13 |
ASTM D257 |
|
Dielectric Constant |
1MHz |
7 |
ASTM D150 |
★ Application
LED chip
Communication equipment,
Mobile phone CPU,
Memory module,
IGBT
Power modules,
Power semiconductor field.
★ Usage
★ Production Process
Mix Stir
Extrusion
Thermal Pad Production Line
Crop
Package
Outgoing Goods
★R&D Center
Voltage Breakdown Tester
Thermal Conductivity Tester
Kneader
Laboratory
★Features And Benefits
1.One of the standout features of this thermal paste is its excellent heat conductivity, which clocks in at an impressive 12 W/M-K. This means that it is highly effective at transferring heat from your CPU or GPU to your cooling system, ensuring optimal performance and stability for your computer.
2.Another advantage of the -8X20 series is that it is a two-component material that is easy to store. This makes it convenient to keep on hand for any future applications and allows you to use it whenever you need it.
3.This thermal paste also exhibits exceptional high and low-temperature mechanical properties and chemical stability. It can withstand extreme temperatures, both high and low, without degrading over time, ensuring optimal performance no matter the conditions.
★ Certificates
